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| INTEGRATED CIRCUITS DATA SHEET PCF50603 Controller for power supply and battery management Preliminary specification 2003 Oct 31 Philips Semiconductors Preliminary specification Controller for power supply and battery management CONTENTS 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.2 8.3 8.4 8.5 8.5.1 8.5.2 FEATURES System control Supply voltage generation Battery management Subscriber identity module card interface APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION On/off control Operating states Reset generation Watchdog timer Automatic restart after battery removal Debounce filters Serial interface (I2C-bus) Interrupt controller (INT) Power supply modules Main battery charger (MBC) Supported charger plugs External components 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 PCF50603 Backup battery charger (BBC) SIM card interface (SIMI) Battery voltage monitor (BVM) Temperature high sensor (TS) Real time clock (RTC) Pulse-width modulator (PWM1 and PWM2) LED modulator (LED1 and LED2) General purpose outputs (GPO) LIMITING VALUES CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS 2003 Oct 31 2 Philips Semiconductors Preliminary specification Controller for power supply and battery management 1 1.1 FEATURES System control PCF50603 * Serial 400 kHz I2C-bus interface to transfer the control data between the PCF50603 and the host controller * On/Off Control (OOC) module to control the power ramp-up and ramp-down sequences for the handset. Furthermore it determines the supported system operating states: NOPOWER, SAVE, STANDBY and ACTIVE to realize minimum power consumption in all states. * Internal Current Controlled Oscillator (CCO) generates the internal high clock frequency. The generated frequency is typically 3.6 MHz. * An accurate 32.768 kHz oscillator. This oscillator can be used to supply the 32 kHz clock domains in the system, to improve the accuracy of the internal clock and to reduce the power consumption of the PCF50603. * Interrupt controller (INT) that generates the interrupt request for the host controller. All interrupt sources can be masked. * The Real Time Clock (RTC) module uses the 32 kHz clock to provide time reference and alarm functions with wake up control for the handset * One accessory recognition pin with debounce filters and capability to start up the system (REC1_N) * One accessory detection comparator input pin with programmable threshold levels that issues an interrupt when an accessory is connected (REC2_N) * Two Pulse-Width Modulators (PWM1 and PWM2) which generate an output voltage with programmable duty cycle and frequency * Two LED modulators (LED1 and LED2) capable of generating eight different blinking patterns with eight different repetition periods * Three General Purpose Outputs (GPO) programmable via the serial interface. The GPOs are open-drain NMOST outputs, capable of handling the full battery voltage range and high sink currents. The GPOs can be programmed to be continuously active LOW or 3-state, in addition the GPO outputs can be controlled by the LED or PWM modulators. * Watchdog timer that can be activated by software. 1.2 Supply voltage generation * The power supplies have three programmable activity modes (OFF, ECO and ON). In the ACTIVE state, the operation modes can be selected by the two external pins PWREN1 and PWREN2. * One Charge Pump (CP) with programmable output voltage for the supply of white or blue LEDs * Two 100 mA LDO voltage regulators (RF1REG and RF2REG) with fixed output voltage (mask programmable) for RF supplies. RF1REG and RF2REG are optimized for low noise, high power supply rejection and excellent load regulation. * Two 150 mA LDO voltage regulators (D1REG and D2REG) optimized for small external capacitors. D1REG provides a programmable output voltage, D2REG provides a fixed output voltage (mask programmable). * One 150 mA LDO voltage regulator (IOREG) dedicated for the supply of the I/O pads. IOREG has a fixed output voltage (mask programmable) and is optimized for a small external capacitor. * One 100 mA LDO voltage regulator (LPREG) with fixed output voltage (mask programmable). In low power operation (ECO) mode LPREG can be used to permanently supply parts in the system in all activity states. * One 100 mA LDO voltage regulator (D3REG) with programmable output voltage. D3REG is optimized for a small external capacitor. * One 250 mA LDO voltage regulator (HCREG) with programmable output voltage. The high current HCREG is optimized for applications like hands-free audio. * D1REG, D2REG, D3REG, IOREG and LPREG support ECO mode. In this mode the output current is limited to 1 mA and the internal power consumption is reduced significantly. * The Temperature high Sensor (TS) provides thermal protection for the whole chip * Enhanced ESD protection on all pins that connect to the main battery pack * Microphone bias voltage generator with low noise and high power supply rejection (MBGEN). 2003 Oct 31 3 Philips Semiconductors Preliminary specification Controller for power supply and battery management 1.3 Battery management 1.4 PCF50603 Subscriber identity module card interface * Operates from a three cell NiCd/NiMH or a one cell Li-ion battery pack * Battery Voltage Monitor (BVM) to detect a too low main battery voltage with programmable threshold levels. A low battery condition is reported via the interrupt mechanism. * Charger control. There is an option between two different charger control functions, depending on the configuration: - Configuration Constant Current Constant Voltage (CCCV). Linear charger control supporting Li-ion as well as NiCd/NiMH battery types for a wide range of battery capacities. - Configuration BATMAX comparator that compares the battery voltage against a programmable threshold voltage. This function can be activated by software and is used to detect the end-of-charge. * Supports the use of a backup battery that powers at empty main battery situations. The backup battery is used to supply the RTC, the internal state and the LPVDD supply in it's ECO mode. Goldcaps, Li and Li-ion cells are supported. * Includes a Backup Battery Charger (BBC). A rechargeable backup battery or backup capacitor can be charged from the main battery. For charging, a programmable constant voltage mode is supported. * Two different modes that can be selected with the Subscriber Identity Module card Interface (SIMI): - Transparent interface including an arbiter and signal level translators - Subscriber Identity Module (SIM) card interface with integrated sequencer, arbiter and signal level translators. The sequencer supports and controls card activation and de-activation, warm reset and controlled clock stop for power-down modes. * Dedicated SIM supply (SIMREG). Supports 3.0 V and 1.8 V cards, including a power saving ECO mode for the power-down mode of the SIM card. * Enhanced ESD protection on all pins that connect to the SIM card contact pins. 2 APPLICATIONS * Mobile phones. 3 GENERAL DESCRIPTION The PCF50603 is a highly integrated solution for power supply generation, battery management including charging and a SIM card interface including supply generation. The device is controlled by a host controller via a 400 kHz I2C-bus serial interface. 4 QUICK REFERENCE DATA VSS = REFGND = GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. SYMBOL VBAT VSAVE VCHG PARAMETER main battery input voltage backup battery input voltage charger input voltage DC rectified sine wave; 100 Hz to 120 Hz; note 1 VCHGMIN fCLKCCO Note 1. Not allowed in CCCV configuration. minimum charger voltage enabling MBC module high clock frequency 32 kHz clock available CONDITIONS MIN. 0 0 0 0 - 3.42 TYP. - - - - 2.7 3.6 MAX. 5.7 5.7 15.0 20.0 - 3.78 UNIT V V V V V MHz 2003 Oct 31 4 Philips Semiconductors Preliminary specification Controller for power supply and battery management 5 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PCF50603HN DESCRIPTION PCF50603 VERSION SOT778-1 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm 2003 Oct 31 5 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... dbook, full pagewidth 2003 Oct 31 SCL SDA 2 3 REFC 28 MICBIAS REC2_N 12 13 GPO1 GPO2 GPO3 48 47 46 6 Philips Semiconductors Controller for power supply and battery management ONKEY_N RSTHC_N 27 11 CLK32K 4 PWREN1 6 PWREN2 5 REC1_N 1 IRQ_N 10 INT CONTROLLER 32kHz OSCILLATOR 26 25 OSCI OSCO BLOCK DIAGRAM PCF50603 OOC TS temp_ok operation modes system clocks CLOCK GENERATOR UNIT RTC AND ALARM I2C-BUS INTERFACE control data status data reference voltage bias currents BBC ON-CHIP REFERENCE BATMAX COMPARATOR AND MBC 33 34 CHGDRV CHGCUR/ BATMAX AUDIO DETECTION BVM 31 VBAT 6 GPO PWM1 AND PWM2 LED1 AND LED2 INTERNAL SUPPLY MODULE internal supply 30 32 29 36 37 VSAVE VCHG VINT CPVBAT SCP SCN CPVDD SIMCKHC SIMIOHC SIMRSHC_N SIMCKCD SIMIOCD SIMRSCD_N SIMEN SIMVCC 8 9 7 43 42 44 45 41 SIMREG D3REG IOREG D2REG D1REG LPREG RF1REG RF2REG HCREG SIMI CP 38 35 Preliminary specification PCF50603 40 39 14 15 IOD2VBAT 16 D2VDD 21 20 LPD1VBAT 19 22 23 24 18 17 MDB679 SIMD3VBAT IOVDD D3VDD D1VDD LPVDD RF12VBAT HCVBAT RF1VDD RF2VDD HCVDD Fig.1 Block diagram. Philips Semiconductors Preliminary specification Controller for power supply and battery management 7 PINNING SYMBOL VSS and REFGND REC1_N SCL SDA CLK32K PWREN2 PWREN1 SIMRSHC_N SIMCKHC SIMIOHC IRQ_N RSTHC_N MICBIAS REC2_N IOVDD IOD2VBAT D2VDD HCVDD HCVBAT LPVDD LPD1VBAT D1VDD RF1VDD RF12VBAT RF2VDD OSCO OSCI ONKEY_N REFC VINT VSAVE VBAT VCHG PIN - 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SUPPLY n.a. VINT IOVDD IOVDD IOVDD IOVDD IOVDD IOVDD IOVDD IOVDD IOVDD IOVDD n.a. MICBIAS n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a. VINT VINT VINT n.a. n.a. n.a. n.a. n.a. DESCRIPTION(1) PCF50603 ground and VSS pads of all modules are connected to the ground plane of the package accessory recognition input with debounce filter (active LOW); input with internal pull-up resistor to VINT I2C-bus clock input I2C-bus data input and output 32.768 kHz digital clock output; in ACTIVE state and IOVDD is on control signal input; selects in combination with PWREN1 the ON, OFF or ECO mode of the linear regulators control signal input; selects in combination with PWREN2 the ON, OFF or ECO mode of the linear regulators SIM reset input from host controller (active LOW) SIM clock input from host controller SIM I/O data to or from the host controller with an internal pull-up resistor to IOVDD interrupt request output to host controller (active LOW); open-drain output with an internal pull-up resistor to IOVDD reset output to host controller (active LOW) microphone bias output voltage accessory recognition input with debounce filter and programmable threshold (active LOW) IOREG output voltage IOREG and D2REG input voltage D2REG output voltage HCREG output voltage HCREG input voltage LPREG output voltage LPREG and D1REG input voltage D1REG output voltage RF1REG output voltage RF1REG and RF2REG input voltage RF2REG output voltage 32.768 kHz oscillator output 32.768 kHz oscillator input On-key (active LOW); input with internal pull-up resistor to VINT reference voltage bypass capacitor connection internal supply voltage output backup battery supply voltage main battery supply voltage charger voltage 2003 Oct 31 7 Philips Semiconductors Preliminary specification Controller for power supply and battery management SYMBOL CHGDRV CHGCUR/ BATMAX CPVDD CPVBAT SCP SCN D3VDD SIMD3VBAT SIMVCC SIMIOCD SIMCKCD SIMRSCD_N SIMEN GPO3 GPO2 GPO1 Note PIN 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 SUPPLY n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a. SIMVCC SIMVCC SIMVCC IOVDD n.a. n.a. n.a. DESCRIPTION(1) drive of external charger circuitry (configuration CCCV) configuration CCCV: charger current feedback PCF50603 configuration BATMAX: open-drain output of BATMAX comparator charge pump output voltage charge pump input voltage switching capacitor positive side switching capacitor negative side D3REG output voltage SIMREG and D3REG input voltage SIMREG output voltage SIM I/O data to/from the SIM card; internal pull-up resistor to SIMVCC SIM clock output to the SIM card SIM reset output to the SIM card (active LOW) enable SIMI and SIMREG general purpose open-drain output 3 general purpose open-drain output 2 general purpose open-drain output 1 1. One ESD diode reverse biased to VSS except pin VCHG who has one clamp in series with a 500 resistor connected between pad and VSS. 2003 Oct 31 8 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 20 LPD1VBAT 18 HCVBAT 24 RF2VDD 25 OSCO 26 OSCI 27 ONKEY_N 28 REFC 29 VINT 30 VSAVE 31 VBAT 32 VCHG 33 CHGDRV 34 CHGCUR/BATMAX 35 CPVDD 36 CPVBAT 13 REC2_N MICBIAS 12 RSTHC_N 11 IRQ_N 10 SIMIOHC SIMCKHC SIMRSHC_N PWREN1 PWREN2 CLK32K SDA SCL REC1_N 9 8 7 6 5 4 3 2 1 PCF50603HN GPO1 48 GPO2 47 GPO3 46 SIMEN 45 SIMRSCD_N 44 SIMCKCD 43 SIMIOCD 42 SIMVCC 41 SIMD3VBAT 40 D3VDD 39 22 RF1VDD handbook, full pagewidth SCN 38 23 RF12VBAT 15 IOD2VBAT 17 HCVDD 21 D1VDD 16 D2VDD 19 LPVDD 14 IOVDD SCP 37 MDB680 Bottom view. All GND and VSS pads are connected to the ground plane. Fig.2 Pin configuration. 2003 Oct 31 9 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8 8.1 8.1.1 FUNCTIONAL DESCRIPTION On/off control OPERATING STATES PCF50603 The PCF50603 has four operating states (see Fig.3): * NOPOWER * SAVE * STANDBY * ACTIVE. handbook, full pagewidth NOPOWER VBAT < VVERY_LOW_BAT AND VSAVE < VVERY_LOW_BACK SAVE VBAT < VVERY_LOW_BAT AND VSAVE > VVERY_LOW_BACK OR VCHG > VVERY_LOW_BAT AND VCHG < VVERY_LOW_BAT STANDBY VBAT > VVERY_LOW_BAT ACTIVE VBAT > VLOW_BAT MDB681 Fig.3 State diagram. 8.1.2 RESET GENERATION The OOC generates an internal and an external reset each time the system goes from STANDBY to ACTIVE state. All registers for the regulators and converters are reset to their default values. The RSTHC_N is kept LOW for minimum 10 ms after entering the ACTIVE state. If the IOREG supply is switched off, RSTHC_N becomes LOW again (see Fig.4). A special condition occurs when the main battery voltage drops below the VVERY_LOW_BAT limit of typically 2.7 V; the RSTHC_N is asserted in order to shut down the host controller immediately (see Fig.5). 2003 Oct 31 10 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 handbook, full pagewidth system state STANDBY treset = 10 ms ACTIVE STANDBY RSTHC_N xxVDD 32 kHz oscillator CLK32K MDB682 Before the supplies are turned on, the internal 32 kHz clock is already stable. After power up of the IOVDD supply the external clock on pin CLK32K becomes available. Fig.4 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition). handbook, full pagewidth system state STANDBY treset = 10 ms ACTIVE STANDBY RSTHC_N SIM emergency deactivation SIM activation xxVDD 32 kHz oscillator CLK32K MDB683 Before the supplies are turned on, the internal 32 kHz clock is already stable. After power up of the IOVDD supply the external clock on pin CLK32K becomes available. Fig.5 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition). 2003 Oct 31 11 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.1.3 WATCHDOG TIMER PCF50603 phone due to mechanical bounce on the battery. The automatic restart is enabled or disabled by control bit BATRM_EN in the OOCC register. By default this automatic restart feature is disabled. Status bit BATRMSTAT in the OOCS2 register indicates whether the PMU returned to ACTIVE state due to a restart after battery removal. The status bit remains active until the PMU returns to STANDBY or SAVE state. Figure 6 shows the timing for an automatic restart due to battery removal. This feature is only triggered by battery removal (VBAT < 2.7 V). All other shut-down conditions like, low battery, high temperature, programming GO_STDBY do not trigger this function. This feature is only applicable upon the condition that a BBC (VSAVE > VVERY_LOW_BACK) is available in the system. The OOC contains a WatchDog Timer (WDT). By default it is not activated. It can be activated by setting bit WDT_RST in the OOCC register to logic 1. Once this bit has been set, the watchdog is enabled, and needs to be cleared once every eight seconds. If the watchdog is not reset in time, the PCF50603 automatically goes to the STANDBY state when the watchdog timer expires. Status bit WDTEXP is set when the watchdog timer expires. After each ACTIVE to STANDBY transition the WDT is disabled and needs to be activated again by software when entering the ACTIVE state. 8.1.4 AUTOMATIC RESTART AFTER BATTERY REMOVAL The PMU allows for an automatic restart from SAVE to ACTIVE state when the main battery is removed for a period less than two seconds (tBATRMLIM). This feature is especially convenient to avoid accidental switch-off of the system handbook, full pagewidth state ACTIVE SAVE VLOW_BAT VBAT VVERY_LOW_BAT VSAVE VLOW_BACK CLK32K RSTHC_N xxVDD BATRMSTAT (internal status bit) treset MCE539 Fig.6 Automatic restart after battery removal. 2003 Oct 31 12 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.1.5 DEBOUNCE FILTERS PCF50603 Fig.7 is applicable for all debounce filters in the PCF50603. handbook, full pagewidth un-debounced tdebounce debounced tdebounce interrupts falling edge rising edge MDB684 The debounced signal keeps the old value until the new value has been stable for at least the applicable debounce time. Any spike (>30 ms) in the original signal will reset the debounce timer again. This filter suppresses all signal changes that are shorter than the debounce time. Fig.7 Definition of debounce filter. 8.2 Serial interface (I2C-bus) The I2C-bus is the serial interface of the PCF50603. A detailed description of the I2C-bus specification, including applications, is given in the brochure: The I2C-bus and how to use it, order no. 9398 393 40011 or I2C-bus Peripherals Data Handbook IC12. 8.3 Interrupt controller (INT) The interrupt module is powered in all states (except NOPOWER) and retains the register values. Events that occur in the STANDBY state, are captured and can be read out by the system controller once the system is in the ACTIVE state. The IRQ_N signal is asserted in the ACTIVE state whenever one or more PCF50603 interrupts are active. Each interrupt register (8-bits) is cleared when it is read (R&C) through the I2C-bus interface. New interrupts that occur during a R&C action are captured in an intermediate register (see Figs.8 and 9). All interrupts related to shut-down conditions (LOWBAT, ONKEY1S and HIGHTMP) are automatically cleared on a transition from ACTIVE to STANDBY state. All interrupts can be masked: this effectively prevents that IRQ_N is asserted for masked interrupts. Masking is implemented with a mask bit in the mask registers for each interrupt source. Nevertheless, the interrupt status registers still provide the actual interrupt status of the masked interrupts, which allows polling of the interrupt status registers. Note that if the mask bit is cleared for an active interrupt, the IRQ_N line goes LOW at the next falling edge of the output pin CLK32K. The PCF50603 uses the interrupt controller to indicate to the system controller if the status of the PCF50603 change and that an action of the system controller is required. Interrupts can be generated by several modules of the PCF50603. The interrupt generator handles all interrupts with the same priority. Priority setting shall be done by the system controller software. There are no timing requirements for interrupt service response times. All events that require immediate actions are performed by the PCF50603 without any action by the system controller. The function of the interrupt module is to capture, mask and combine the interrupt signals from the modules that can generate an interrupt. All interrupts are combined in the interrupt signal IRQ_N. The IRQ_N signal is implemented as an open-drain output with an internal pull-up resistor. 2003 Oct 31 13 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 handbook, full pagewidth IRQ_N (1) I2C-bus read request & address read INT1 read INT2 read INT3 MDB685 Read access can be done with or without incremental addressing. (1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts. Fig.8 Interrupt timing; no interrupt captured during read sequence. handbook, full pagewidth minimal 1 CLK32 IRQ_N (1) I2C-bus read request & address read INT1 read INT2 read INT3 MDB686 Read access can be done with or without incremental addressing. (1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts. Fig.9 Interrupt timing; interrupt captured during read sequence. 2003 Oct 31 14 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.4 Power supply modules PCF50603 In total 11 power supply modules are available in the PCF50603; see Table 1: * Three regulators for supplying the digital and analog circuitry (D1REG, D2REG and D3REG). These regulators support the ECO mode * One regulator for high current supply (HCREG) * One regulator for the SIMI supply (SIMREG) * One charge pump (CP) * One regulator for supplying the I/O pads (IOREG). This regulator supports the ECO mode * One regulator for low power supply (LPREG). This regulator supports the ECO mode, the LPREG is the only regulator that can be enabled in SAVE and STANDBY state (ECO mode only) * Two low-noise regulators for RF supply (RF1REG and RF2REG) * One ultra low-noise regulator for supplying a microphone (MBGEN). Table 1 Power supply modules; VSS = REFGND = GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. NOMINAL CURRENT (mA) MINIMUM MAXIMUM VOLTAGE VOLTAGE VOLTAGE STEPS (V) (V) (mV) RESET VOLTAGE (V) ECO MODE PSRR(1) (dB) SIZE EXTERNAL CAPACITOR(2) (nF) SUPPLY NAME Programmable power supplies D1REG D3REG HCREG SIMREG CP 150 100 250 (4) 20 75(6) 1.20 1.20 2.60 1.80 3.50 3.20 3.20 3.20 3.00 5.00 100 100 200 - 500 note 3 note 3 note 3 1.8 note 3 yes yes no yes(5) no 60 60 60 60 - 60 60 60 70 70 470 470 4700 1000 220/4700(7) Fixed power supplies, mask programmable D2REG IOREG LPREG RF1REG (8) RF2REG (8) 150 150 100 100 100 1.20 1.20 1.20 2.60 2.60 3.20 3.20 3.20 3.00 3.00 100 100 100 100 100 - note 3 note 3 note 3 note 3 note 3 yes yes yes no no 470 470 470 4700 4700 Fixed power supply MBGEN Notes 1. Typical value, 100 Hz < f < 1000 Hz. 2. Typical values assume X5R or X7R type of capacitor. 3. Mask programmable for reset settings of different types. 4. Under specific conditions a nominal current of 300 mA can be delivered. 5. When SIMI is in Power-down mode. 6. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA. 7. The CP module requires both a switching capacitor as well as an output capacitor. 8. Optimized for low noise (30 V RMS value, 400 Hz < f < 80 kHz). 1.5 2.15 2.15 2.15 yes 110 4700 2003 Oct 31 15 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.5 Main battery charger (MBC) PCF50603 The fast charge current is determined by the value of the external sense resistor. The charge current in the pre and trickle charge phase is programmable as a ratio of the fast charge current. In BATMAX configuration an end-of-charge indication is available on the BATMAX pin. 8.5.1 SUPPORTED CHARGER PLUGS The main battery charger (MBC) module provides a complete constant-current/constant-voltage linear charger controller for lithium-ion (Li-ion) batteries (in CCCV configuration) or a programmable battery threshold level detector for end-of-charge indication (configuration BATMAX). Nickel-cadmium (NiCd) and Nickel metal hydride (NiMH) batteries can also be charged with constant current. Only an external power PNP transistor is required to control the charge current. The CC and CCCV control circuitry is fully integrated in the PCF50603 charging module. In CCCV configuration the charging process for Li-ion/Li-pol batteries is performed under control of the host controller. The communication between the PCF50603 charger module and the host controller is interrupt based, which simplifies the control of the PCF50603. The PCF50603 charger circuitry supports the following type of charger plugs (see Fig.10): * Regulated charger plugs with output voltage at least 0.5 V above the battery voltage with a maximum of 10 V and with current limitation up to 3C of the used battery (CCCV and BATMAX configuration) * Non regulated charger plugs with peak output voltages up to 20 V with a duration of less than 14 ms and with current limitation up to 3C of the used battery (BATMAX configuration only). handbook, full pagewidth VCHG VCHG 15 V < 14 ms < 14 ms 10 V 10 V 2.7 V ICHG 2.7 V t MDB687 Regulated charger plug. Non regulated charger plug. Fig.10 Characteristics of the supported charger plugs. 2003 Oct 31 16 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.5.2 EXTERNAL COMPONENTS PCF50603 A small discrete circuit must be used to control the charge current (see Fig.11). handbook, halfpage VCHG CHGDRV CHGCUR 0.15 VBAT Rsense BC869(1) MDB688 (1) The charge switch requires a current gain in the range of 50 to 400 for stable loop operation. Fig.11 Charge current external circuitry. 8.6 Backup battery charger (BBC) The BBC is implemented as a voltage limited current source with a selectable output resistor. It offers the following features: * Selectable output resistor to reduce the current at higher voltages * Four programmable charge currents * Two programmable maximum limiting voltages * The BBC can be enabled in the ACTIVE state; in all other states the BBC is disabled. 8.7 SIM card interface (SIMI) * In transparent mode the SIMEN input allows the host controller to have direct control over the SIM card supply. In sequencer mode the SIMEN input indicates the presence of a SIM card. * Enhanced ESD protection on all SIM contact pins * The SIMI and SIMREG can be enabled in the ACTIVE state. In all other states the SIMI and SIMREG are disabled. 8.8 Battery voltage monitor (BVM) The BVM monitors the main battery voltage. It offers the following features: * Programmable low battery threshold (VLOW_BAT) * Hysteresis and selectable debounce filter built in to prevent fast cycling * The BVM is enabled in all activity states. The BVM observes permanently the main battery voltage and generates a LOWBAT interrupt if the battery voltage drops below the programmed threshold voltage VLOW_BAT (see Fig.12). When a LOWBAT interrupt is generated in ACTIVE state, the host controller should initiate a transition to STANDBY state. In case the host controller does not initiate a transition to the STANDBY state within eight seconds after the interrupt occurred, the OOC forces the PCF50603 to the STANDBY state in order to prevent a too deep discharge of the battery. The SIMI provides the facilities to communicate with SIM. It offers the following features: * Support for transparent mode. The host controller controls the communication with the SIM card, including the activation and deactivation sequences. * Support for sequencer mode. The internal sequencer of the PCF50603 performs the activation and deactivation sequences. * Includes a dedicated linear regulator for the SIM card supply (SIMREG) supporting both 1.8 V and 3.0 V cards * Provides level-shifters for the SIM interfacing signals. The level-shifters translate the host controller signal levels (IOVDD) to SIM card signal levels (SIMVCC) and vice versa. 2003 Oct 31 17 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 handbook, full pagewidth V VBAT VLOW_BAT Vhys tdebounce LOWBAT interrupt t MDB689 Fig.12 BVM and LOWBAT behaviour. 8.9 Temperature high sensor (TS) The TS monitors the junction temperature of the PCF50603. It offers the following features: * Fixed temperature threshold * Hysteresis and debounce filter built in to prevent fast cycling * The TS is enabled in ACTIVE state, in all other states the TS is disabled. The behaviour of the TS is shown in Figure 13. A HIGHTMP interrupt is generated when the temperature threshold is passed for more than 62 ms (debouncing time). When a HIGHTMP interrupt is generated the host controller should initiate a transition to STANDBY state. In case the host controller does not initiate a transition to the STANDBY state within 1 second after the interrupt occurred, the OOC forces the PCF50603 to the STANDBY state in order to prevent damage to the circuit. The hysteresis and debounce time have been built in to prevent fast cycling of the HIGHTMP signal. The TS can not be disabled via the I2C-bus. handbook, full pagewidth Tj 150 C 130 C Thys tdebounce HIGHTMP interrupt tdebounce t MDB690 Fig.13 TS behaviour. 2003 Oct 31 18 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.10 Real time clock (RTC) 8.12 PCF50603 LED modulator (LED1 and LED2) The RTC module provides the time information to the handset based on a 1 Hz clock frequency. Basically it is a 32-bit counter counting elapsed seconds. * The RTC module contains one alarm function that generates an interrupt if the actual RTC time equals the content of the alarm register. The alarm registers are preset to all 1 s which effectively disables the alarm; effectively no alarm interrupt will be generated as long as the RTC counter does not overflow. It is recommended to mask the ALARM interrupt before a new value is written to the alarm registers, in order to prevent interrupts during the write actions (a new setting may require up to 4 register writes). * The RTC module is able to generate an interrupt each second (SECOND interrupt) as well as each minute (MINUTE interrupt). When the RTC starts up the first time (after transition from NOPOWER state) the minute interrupt is aligned with each 60 seconds crossing. If the synchronization with the 60 second crossing is required after reprogramming the RTC time registers it is up to the software to program the RTC time registers with a modulo 60 value. 8.11 Pulse-width modulator (PWM1 and PWM2) The PCF50603 contains two LED modulators (LED1 and LED2), which can be selected as input for any of the GPO outputs. The LED modulator of the PCF50603 is used for the control of the indicator LEDs. They offer the following features: * The LED driver can select eight different repetition periods * Capable of generating eight different blinking patterns. The selected pattern is generated once per repetition period * The LED can be used as a status indicator during the ACTIVE state or when a charger is connected. 8.13 General purpose outputs (GPO) The PCF50603 contains three high current (100 mA) open-drain GPOs. They offer the following features: * Each GPO can be configured as a constant LOW level, a high impedance, a LED modulator output, a PWM output or as the complementary PWM output PWM * The GPOs can sink 100 mA from any supply or battery voltage. The two PWMs (PWM1 and PWM2) offer the following features: * Programmable frequency and duty cycle * Any of the GPOs can be connected to either the PWMs or the inverse of the PWMs * The PWMs can be independently enabled in ACTIVE state. In all other states the PWMs are disabled. 2003 Oct 31 19 Philips Semiconductors Preliminary specification Controller for power supply and battery management 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VBAT VSAVE VCHG VI II IO Ptot Tamb Tstg Vesd PARAMETER main battery voltage backup battery input voltage charger input voltage input voltage on any pin with respect to REFGND input current at any input output current at any output total power dissipation operating ambient temperature storage temperature electrostatic discharge voltage HBM; note 1 pins SIMEN, IOD2VBAT, SIMD3VBAT, SIMRSCD_N, SIMCKCD, SIMIOCD, VBAT, VSAVE, CPVBAT, LPD1VBAT, REC1_N, SIMVCC, RF12VBAT, HCVBAT, REC2_N pin VCHG other pins MM; note 2 Notes 1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 k resistor. 2. Machine Model: equivalent to discharging a 200 pF capacitor via a 0 resistor. 10 CHARACTERISTICS VSS = REFGND = GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. SYMBOL VBAT VSAVE VCHG PARAMETER main battery input voltage backup battery input voltage charger input voltage DC rectified sine wave; 100 Hz to 120 Hz; note 1 VCHGMIN fCLKCCO VO IO minimum charger voltage enabling MBC module high clock frequency 32 kHz clock available CONDITIONS 0 0 0 0 - 3.42 MIN. - - - - 2.7 3.6 - - TYP. - CONDITIONS MIN. -0.5 -0.5 -0.5 -0.5 -10 -10 - -40 -55 PCF50603 MAX. +6.5 +6.5 +20 +6.5 +10 +10 2000 +85 +150 6000 UNIT V V V V mA mA mW C C V - - - 4000 2000 200 V V V MAX. 5.7 5.7 15.0 20.0 - 3.78 UNIT V V V V V MHz D1 regulator output voltage output current 1.20 - 3.20 150 V mA 2003 Oct 31 20 Philips Semiconductors Preliminary specification Controller for power supply and battery management SYMBOL D3 regulator VO IO VO IO VO IO VO IO VO IO VO IO VO IO VO IO VO IO VO IO Notes 1. Under specific conditions a nominal current of 300 mA can be delivered. output voltage output current 1.20 - 2.60 note 1 - 1.80 - 3.50 note 2 - 1.20 - 1.20 - 1.20 - 2.60 - 2.60 - 2.15 - - - - - - - - - - - - - - - - - - - - - PARAMETER CONDITIONS MIN. TYP. PCF50603 MAX. UNIT 3.20 100 V mA HC regulator output voltage output current 3.20 250 V mA SIM regulator output voltage output current 3.00 20 V mA CP regulator output voltage output current 5.00 75 V mA D2 regulator output voltage output current 3.20 150 V mA IO regulator output voltage output current 3.20 150 V mA LP regulator output voltage output current 3.20 100 V mA RF1 regulator output voltage output current 3.00 100 V mA RF2 regulator output voltage output current 3.00 100 V mA MBGEN regulator output voltage output current 2.15 1.5 V mA 2. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA. 2003 Oct 31 21 Philips Semiconductors Preliminary specification Controller for power supply and battery management 11 APPLICATION INFORMATION PCF50603 handbook, full pagewidth MAIN BATTERY 2.2 F 2.2 F VBAT 31 RF12VBAT LPD1VBAT IOD2VBAT SIMD3VBAT CPVBAT HCVBAT 23 20 15 40 36 18 VSAVE 30 VINT battery backup 470 nF 34 28 33 32 12 MICBIAS 4700 nF (1) RAM 1.8 V FLASH 1.8 V AUXADCx RSENSE CHGCUR CHGDRV BATTERY + CHARGER CONSTANT CURRENT - VCHG (3) 29 REFC 100 nF 17 on key ONKEY_N HCVDD 27 19 LPVDD 4700 nF (2) MICP RF1VDD RF UNIT 4700 nF RF2VDD 4700 nF SCP 220 nF SCN CPVDD 4700 nF 470 nF 22 MICN 24 13 37 38 35 14 IOVDD 1 21 REC2_N REC1_N D1VDD headset from bottom connector 470 nF VDDA VDDD 470 nF PCF50603 16 D2VDD PCF5213 470 nF VDDE3 470 nF VDDA VDDC back light EL lamp or DC DC GPO3 46 39 D3VDD GPO2 back light GPO1 OSCI 10 pF 32.768 kHz 10 M 10 pF IOVDD 10 k SIMEN card present SIM CARD READER SIMRSCD_N SIMIOCD SIMCKCD SIMVCC 1000 nF OSCO VDDE1 47 48 26 PWREN1 PWREN2 RSTHC_N IRQ_N CLK32K SDA SCL SIMIOHC SIMCKHC SIMRSHC_N revmod VDDE2 LOWVOLT_N ONKEY 1 k 6 25 5 11 10 45 44 42 43 41 REFGND/VSS 4 3 2 9 8 7 1 k AUXON_N GPON0 RFSIGx RSTON SIMERRN CLK32I SDA SCL SIMIO SIMCLK GPOx MDB691 (1) HCVDD is reserved for hands free audio supply. (2) LPVDD not used in the system. (3) Connect VCHG to ground if charger is used in BATMAX configuration. Fig.14 Application diagram. 2003 Oct 31 22 Philips Semiconductors Preliminary specification Controller for power supply and battery management 12 PACKAGE OUTLINE HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm PCF50603 SOT778-1 D B A terminal 1 index area A E A1 c detail X e1 e 13 L 12 1/2 e C b 24 25 vMCAB wMC y1 C y e Eh 1/2 e e2 1 terminal 1 index area 48 Dh 0 DIMENSIONS (mm are the original dimensions) A(1) UNIT max. mm 1 A1 0.05 0.00 b 0.25 0.15 c 0.2 D (1) 6.1 5.9 Dh 4.25 3.95 E (1) 6.1 5.9 Eh 4.25 3.95 e 0.4 37 36 X 2.5 scale e1 4.4 e2 4.4 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1 5 mm Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT778-1 REFERENCES IEC --JEDEC --JEITA --EUROPEAN PROJECTION ISSUE DATE 02-07-05 2003 Oct 31 23 Philips Semiconductors Preliminary specification Controller for power supply and battery management 13 SOLDERING 13.1 Introduction to soldering surface mount packages PCF50603 with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 220 C (SnPb process) or below 245 C (Pb-free process) - for all BGA and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 235 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards 2003 Oct 31 24 Philips Semiconductors Preliminary specification Controller for power supply and battery management 13.5 Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP PMFP(8) Notes not suitable not suitable(4) PCF50603 SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable suitable not not recommended(5)(6) recommended(7) not suitable 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. 2003 Oct 31 25 Philips Semiconductors Preliminary specification Controller for power supply and battery management 14 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION PCF50603 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 16 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 Oct 31 26 Philips Semiconductors Preliminary specification Controller for power supply and battery management 17 PURCHASE OF PHILIPS I2C COMPONENTS PCF50603 Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2003 Oct 31 27 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R54/01/pp28 Date of release: 2003 Oct 31 Document order number: 9397 750 11771 |
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